Graftek Turnkey Systems
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Monolith Open Area Testing System
- Designed for Monolith Inspection
- 8.3 µm/px resolution
- 12″ x 10.5″ Inspection area
- 1.5 – 6 min Inspection time
- High-resolution imaging in a single pass
- No manual repositioning of monoliths required
- < 2 seconds image processing time per monolith
- Intuitive, Touchscreen User Interface
- Seamless Data Logging and Historical Review
- Tested and validated for coated and uncoated monoliths
- Fully customizable to meet specific inspection requirements
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Residue Detection System
- Covered under our Patent US20140263981A1, whose advanced lighting technology improves contrast for detecting metal particles on patterned surfaces
- 200mm Wafer Inspection
- ≥ 5 mm Defect Detection
- Up to 300 Wafers inspected per hour
- 99.9% inspection in one shot
- No movement of the wafer required
- <1 second processing time
- User-Friendly Interface
- Seamless Integration with QC Systems
- Tested and validated for Copper and Tungsten
- Customizable Configuration
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Display Inspection Vision System
- Suitable for displays between 10.1″ and 22″
- Provides high-quality illumination
- Cleans UUT for accurate inspection
- Identifies defects based on criteria
- Easy to operate
- Generates comprehensive reports
- Ensures reliable results
- Provides guidelines for upkeep
- Compatible with other quality control systems
- Can be tailored to specific needs
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Color Recognition Imaging System
- No operator training
- Check colors anywhere
- Get same measurements with multiple systems
- Color classification at pixel level
- Customized measurements based on color classification
- Samples up to 200 mm x 200mm
- Integrated touchscreen
- Historical record keeping
| Model | Description |
|---|---|
| Monolith Open Area Testing System | High-precision imaging system designed to inspect and analyze monoliths used in various industrial applications. |
| Residue Detection System | Advanced, high-throughput automated inspection platform designed to detect residual metal and other defects on semiconductor wafers during the Chemical Mechanical Planarization (CMP) process. |
| Display Inspection Vision System | Comprehensive machine vision system designed for inspecting the quality of various display components, including full assembly displays, bezels, and lenses. |
| Color Recognition Imaging System | Digital color assessment system that provides pixel-level color classification. |
| Bottle Inspection System | Gauge built to Industrial Equipment Specifications to measure the finish dimensions of HDPE bottles including T, E, H, S, N, height and Finish Flatness. |